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 Freescale Semiconductor Technical Data
MPXM2102 Rev 4, 09/2005
100 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors
The MPXM2102 device is a silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output - directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Features * * * * Temperature Compensated Over 0C to +85C Available in Easy-to-Use Tape & Reel Ratiometric to Supply Voltage Gauge Ported and Non Ported Options
MPXM2102 SERIES
COMPENSATED AND CALIBRATED PRESSURE SENSOR 0 TO 100 kPA (0 TO 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
MPAK PACKAGES
Typical Applications * * * * * * * Pump/Motor Controllers Robotics Level Indicators Medical Diagnostics Pressure Switching Barometers Altimeters ORDERING INFORMATION
Device Type Nonported Options Gauge Gauge Absolute Absolute Ported Gauge, Axial Port Gauge, Axial Port Case No. MPX Series Order No. Packing Options Rails Device Marking MPXM2102D 1 2 MPXM2102D/A CASE 1320-02
MPXM2102GS/AS CASE 1320A-02
Pin Number
Gnd +Vout 3 4 VS -Vout
1320 MPXM2102D 1320 MPXM2102DT1 1320 MPXM2102A 1320 MPXM2102AT1 1320A MPXM2102GS 1320A MPXM2102GST1
Tape & Reel MPXM2102D Rails MPXM2102A
Tape & Reel MPXM2102A Rails MPXM2102G
Tape & Reel MPXM2102G Rails MPXM2102A
Absolute, Axial 1320A MPXM2102AS Port Absolute, Axial 1320A MPXM2102AST1 Port
Tape & Reel MPXM2102A
(c) Freescale Semiconductor, Inc., 2005. All rights reserved.
Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
VS 3 Thin Film Temperature Compensation and Calibration Circuitry 1 GND
X-ducer Sensing Element
2
Vout+
4V out-
Figure 1. Temperature Compensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the sensor is directly proportional to the differential pressure applied. Table 1. Maximum Ratings(1)
Rating Maximum Pressure Storage Temperature Operating Temperature
The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side relative to the vacuum side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum side relative to the pressure side.
Symbol Pmax Tstg TA
Value 200 -40 to +125 -40 to +125
Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPXM2102 2 Sensors Freescale Semiconductor
Table 2. Operating Characteristics (VS = 10 Vdc, TA = 25C.)
Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) (0 to 100 kPa) Temperature Hysteresis(5) (-40C to +125C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Offset Stability(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: * Linearity: * * * * Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. MPXM2102D/G Series MPXM2102A Series MPXM2102D/G Series MPXM2102A Series Symbol POP VS Io VFSS Voff V/P -- -- -- -- TCVFSS TCVoff Zin Zout tR -- -- Min 0 -- -- 38.5 -1.0 -2.0 -- -0.6 -1.0 -- -- -2.0 -1.0 1000 1400 -- -- -- Typ -- 10 6.0 40 -- -- 0.4 -- -- 0.1 0.5 -- -- -- -- 1.0 20 0.5 Max 100 16 41.5 1.0 2.0 -- 0.4 1.0 -- -- 2.0 1.0 2500 3000 -- -- -- Unit kPa Vdc mAdc mV mV
mV/kPa %VFSS %VFSS %VFSS %VFSS mV ms ms %VFSS
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXM2102 Sensors Freescale Semiconductor 3
LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the
"best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. The specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.
Least Squares Fit Exaggerated Performance Curve Relative Voltage Output Least Square Deviation
Least Square Deviation Straight Line Deviation
End Point Straight Line Fit
Offset 0 50 Pressure (% Fullscale) 100
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION Figure 3 shows the minimum, maximum and typical output characteristics of the MPXM2120 series at 25C. The output
is directly proportional to the differential pressure and is essentially a straight line. A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm.
40 35 30 Output (mVdc) 25 20 15 10 5 0 -5 0
VS = 10 Vdc TA = 25C TYP MAX Span Range (TYP) MIN
kPa PSI
25 3.62
50 7.25
75 10.87
100 14.5
Offset (TYP)
Figure 3. Output versus Pressure Differential
MPXM2102 4 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1320-02 ISSUE B
MPXM2102 Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1320-02 ISSUE B
MPXM2102 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PIN 4
PIN 1
PAGE 1 OF 2
CASE 1320A-02 ISSUE A
MPXM2102 Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1320A-02 ISSUE A
MPXM2102 8 Sensors Freescale Semiconductor
How to Reach Us:
Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2005. All rights reserved.
MPXM2102 Rev. 4 09/2005


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